发明授权
- 专利标题： Solder ball terminal
- 专利标题（中）： 焊球端子
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申请号： US09420711申请日： 1999-10-20
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公开(公告)号： US06352437B1公开(公告)日： 2002-03-05
- 发明人: John O. Tate
- 申请人： John O. Tate
- 主分类号： H01R909
- IPC分类号： H01R909
摘要：
A solder ball terminal includes a body portion, a spherical socket disposed at one end of the body portion, the spherical socket including an interior wall terminating in an annular lip, wherein the annular lip defines an opening of the spherical socket and a solder ball disposed within the socket such that a portion of the solder ball extends through the opening and beyond the annular lip.
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