发明授权
US06359091B1 Polyarylene compositions with enhanced modulus profiles 有权
具有增强的模量分布的聚亚芳基组合物

Polyarylene compositions with enhanced modulus profiles
摘要:
This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.
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