发明授权
- 专利标题: Heatsink and fabrication method thereof
- 专利标题(中): 散热片及其制造方法
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申请号: US09232011申请日: 1999-01-14
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公开(公告)号: US06361857B1公开(公告)日: 2002-03-26
- 发明人: Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
- 申请人: Hirohisa Saito , Yoshiyuki Yamamoto , Kiichi Meguro , Takahiro Imai
- 优先权: JP10-006238 19980116; JP10-216683 19980731; JP10-230187 19980731; JP10-376395 19981222
- 主分类号: B32B900
- IPC分类号: B32B900
摘要:
A thin diamond film layer is formed on a substrate with good adherence. A heatsink includes a substrate of a sintered compact including Cu and W, and a thin diamond film layer formed on the surface of the substrate. The Cu content in the substrate is at least 5% by weight. In an X-ray diffraction chart obtained by irradiating the thin diamond film layer with an X-ray, the diffraction peak intensity of the (110) plane of W is at least 100 times the diffraction peak intensity of the (200) plane of Cu.
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