Disclosed are aqueous photosolder resist compositions containing (A) an aqueous solution prepared by neutralizing a resin containing a free-radically polymerizable group and a carboxyl group with a base; (B) an inorganic filler; (C) a photocurable mixture of (c-1) a multifunctional acrylic monomer, (c-2) a compound having a cyclic ether group other than a glycidyl group and (c-3) a photoinitiator; and optionally (D) an aqueous solution prepared by neutralizing a frege-radically polymerized substance having an acid value of 130-230 mgKOH/mg. The cyclic ether group other than a glycidyl group is an alicyclic epoxy or oxetane group, for example.