发明授权
- 专利标题： Support assembly with thermal expansion compensation
- 专利标题（中）： 支撑组件采用热膨胀补偿
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申请号： US09498795申请日： 2000-02-08
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公开(公告)号： US06364957B1公开(公告)日： 2002-04-02
- 发明人: Gerhard M. Schneider , Hamid Noorbakhsh , Bryan Pu , Kaushik Vaidya , Brad Leroy Mays , Hung Dao , Evans Lee , Hongging Shan
- 申请人： Gerhard M. Schneider , Hamid Noorbakhsh , Bryan Pu , Kaushik Vaidya , Brad Leroy Mays , Hung Dao , Evans Lee , Hongging Shan
- 主分类号： C23C1600
- IPC分类号： C23C1600
摘要：
A substrate support assembly 30 comprises a substrate support 38 and a collar 130 which may comprise at least one slit 150. The slit allows for thermal expansion compensation in the support assembly 30. The collar 130 may, for example, protect the dielectric 45 from erosion in a process chamber 25. In one version, the collar 130 comprises a clamping ring 200 on the dielectric 45.
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