An ultra precision stamped process carrier frame for use in the manufacture of microelectronic devices comprises a frame into which a plurality of precision-stamped apertures are made. Each of the coupon carrying apertures in the frame has a serrated side wall comprising a plurality of fingers extending into the aperture. The ends of the fingers are precision punched to define the aperture that registers the semiconductor coupon simultaneously with the punching of the reference fiducials. Since only the ends of the fingers are punched in the final process operation, the coupon-registering apertures can be held to a tighter tolerance relative to the fidicuals and relative to each other than is possible when the entire side wall of the aperture is punched.