发明授权
US06376276B1 Method of preparing diamond semiconductor 有权
制备金刚石半导体的方法

  • 专利标题: Method of preparing diamond semiconductor
  • 专利标题(中): 制备金刚石半导体的方法
  • 申请号: US09644671
    申请日: 2000-08-24
  • 公开(公告)号: US06376276B1
    公开(公告)日: 2002-04-23
  • 发明人: Ryuichi OishiYoshinobu Nakamura
  • 申请人: Ryuichi OishiYoshinobu Nakamura
  • 优先权: JP11-237132 19990824
  • 主分类号: H01L2100
  • IPC分类号: H01L2100
Method of preparing diamond semiconductor
摘要:
There is provided a method of reliably preparing a diamond semiconductor by irradiating diamond with a corpuscular ray. In this method, when a diamond substrate is irradiated with a corpuscular ray, the diamond substrate is maintained at a temperature of 300° C. to 2000° C., the angle of the surface of the diamond substrate irradiated is set within −20° to +20° to the (001) crystal plane of the diamond substrate, and the angle of the direction of the corpuscular ray is set within −20° to +20° to the crystal orientation of the diamond substrate. Preferably, the direction of the corpuscular ray forms an angle of 3° to 10° with the crystal orientation.
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