A floating interface assembly provides signal paths between an integrated circuit (IC) test head and contact pads on a load board or probe card accessing an IC to be tested. Pogo pins or other contactors for contacting the contact pads are mounted on the interface assembly and linked to the test head by flexible conductors. The interface assembly is attached to the test head by springs to allow it the freedom to rotate to some extent about any axis. As the test head approaches the contact pads, alignment pins engage and orient the interface assembly so that its contactors will mate with the contact pads. As the contactors come into contact with the contact pads, the interface assembly adjusts the plane of the contactors so as to evenly distribute contact pressure over all contactor pads.