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发明授权
US06377460B1 Electronic circuit having a flexible intermediate layer between electronic components and a heat sink 有权
电子电路模块在电子部件和散热器之间具有柔性中间层

  • 专利标题： Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
  • 专利标题（中）： 电子电路模块在电子部件和散热器之间具有柔性中间层
  • 申请号： US09583131
    申请日： 2000-05-30
  • 公开(公告)号： US06377460B1
    公开(公告)日： 2002-04-23
  • 发明人: Jens Pohl , Gerolf Thamm , Andreas Hippe
  • 申请人： Jens Pohl , Gerolf Thamm , Andreas Hippe
  • 优先权： DE19924289 19990527
  • 主分类号： H05K720
  • IPC分类号： H05K720
Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
摘要：
An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.
摘要（中）：

电子电路模块具有与至少一个电子部件热连接的至少一个电子部件和散热器。 所述至少一个电子部件与所述散热器之间的热传导路径由与所述散热片的表面相邻的中间层形成。 中间层由包括柔性导热材料柱的岛状结构形成。

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