公开(公告)号：US06377460B1

公开(公告)日：2002-04-23

申请号：US09583131

申请日：2000-05-30

申请人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

发明人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

IPC分类号： H05K720

CPC分类号： H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.

摘要翻译： 电子电路模块具有与至少一个电子部件热连接的至少一个电子部件和散热器。 所述至少一个电子部件与所述散热器之间的热传导路径由与所述散热片的表面相邻的中间层形成。 中间层由包括柔性导热材料柱的岛状结构形成。