发明授权
- 专利标题： Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
- 专利标题（中）： 电子电路模块在电子部件和散热器之间具有柔性中间层
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申请号： US09583131申请日： 2000-05-30
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公开(公告)号： US06377460B1公开(公告)日： 2002-04-23
- 发明人: Jens Pohl , Gerolf Thamm , Andreas Hippe
- 申请人： Jens Pohl , Gerolf Thamm , Andreas Hippe
- 优先权： DE19924289 19990527
- 主分类号： H05K720
- IPC分类号： H05K720
摘要：
An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.