发明授权
- 专利标题： Die paddle enhancement for exposed pad in semiconductor packaging
- 专利标题（中）： 用于半导体封装中裸露焊盘的焊盘增强
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申请号： US09920599申请日： 2001-08-02
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公开(公告)号： US06380048B1公开(公告)日： 2002-04-30
- 发明人: Tan Hien Boon , Zheng Zheng , Arnel Trasporto
- 申请人： Tan Hien Boon , Zheng Zheng , Arnel Trasporto
- 主分类号： H01L2146
- IPC分类号： H01L2146
摘要：
A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the die-paddle and the surface over which the ground paddle is mounted. The new design further comprises an S-shaped segment between the ground ring and the center of the die-paddle, the S-shaped segment provides stress relieve between the ground ring and the center of the die-paddle.
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