公开(公告)号：US06380048B1

公开(公告)日：2002-04-30

申请号：US09920599

申请日：2001-08-02

申请人： Tan Hien Boon ,  Zheng Zheng ,  Arnel Trasporto

发明人： Tan Hien Boon ,  Zheng Zheng ,  Arnel Trasporto

IPC分类号： H01L2146

CPC分类号： H01L23/49503 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the die-paddle and the surface over which the ground paddle is mounted. The new design further comprises an S-shaped segment between the ground ring and the center of the die-paddle, the S-shaped segment provides stress relieve between the ground ring and the center of the die-paddle.

摘要翻译： 为作为封装半导体器件封装的一部分的裸片提供了新的设计。 本发明的新设计在模桨的接地环和接地桨安装在其上的表面之间产生空间。 新设计还包括在接地环和模桨的中心之间的S形段，S形段在接地环和模桨的中心之间提供应力消除。

公开(公告)号：US06921974B2

公开(公告)日：2005-07-26

申请号：US10400803

申请日：2003-03-28

申请人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

发明人： Tan Hien Boon ,  Liu Hao ,  Park Soo Gil

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.

摘要翻译： 塑料球栅阵列封装具有在封装之前放置在具有半导体器件的衬底上的散热块。 传热构件最初由引导销定位，并通过封装固定就位。