发明授权
US06380615B1 Chip size stack package, memory module having the same, and method of fabricating the module
有权
芯片尺寸堆叠封装，具有相同的存储器模块以及制造该模块的方法
- 专利标题： Chip size stack package, memory module having the same, and method of fabricating the module
- 专利标题（中）： 芯片尺寸堆叠封装，具有相同的存储器模块以及制造该模块的方法
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申请号： US09604091申请日： 2000-06-27
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公开(公告)号： US06380615B1公开(公告)日： 2002-04-30
- 发明人: Sang Wook Park , Jae Myun Kim
- 申请人： Sang Wook Park , Jae Myun Kim
- 优先权： KR99-25252 19990629
- 主分类号： H01L2302
- IPC分类号： H01L2302
摘要：
Disclosed are a chip size stack package, a memory module having the same and a method for fabricating the memory module. In the chip size stack package, two semiconductor chips are arranged in a manner such that their surfaces on which bonding pads are formed, are opposed to each other at a predetermined interval. Insulating layers are applied to the surfaces of the semiconductor chips on which surfaces the bonding pads are formed, in a manner such that the bonding pads are exposed. Metal traces are respectively deposited on the insulating layers and connected to the bonding pads. Solder balls electrically connect the metal traces with each other. One ends of metal wires are bonded to a side of one of the metal traces. Both sides of the semiconductor chips and a space between them are molded by an encapsulate, in a manner such that the other ends of the metal wires are exposed.
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