Invention Grant
US06383828B2 Method of fabricating row lines of a field emission array and forming pixel openings therethrough 失效
制造场致发射阵列的行线并形成穿过其中的像素开口的方法

  • Patent Title: Method of fabricating row lines of a field emission array and forming pixel openings therethrough
  • Patent Title (中): 制造场致发射阵列的行线并形成穿过其中的像素开口的方法
  • Application No.: US09812367
    Application Date: 2001-03-20
  • Publication No.: US06383828B2
    Publication Date: 2002-05-07
  • Inventor: Ammar Derraa
  • Applicant: Ammar Derraa
  • Main IPC: H01L2100
  • IPC: H01L2100
Method of fabricating row lines of a field emission array and forming pixel openings therethrough
Abstract:
A method of fabricating row lines over a field emission array. The method employs only two mask steps to define row lines and pixel openings through selected regions of each of the row lines. In accordance with the method of the present invention, a layer of conductive material is disposed over a substantially planarized surface of a grid of semiconductive material. A layer of passivation material is then disposed over the layer of conductive material. In one embodiment of the method, a first mask may be employed to remove passivation material and conductive material from between adjacent rows of pixels and from substantially above each of the pixels of the field emission array. A second mask is employed to remove semiconductive material from between the adjacent rows of pixels. In another embodiment of the method, a first mask is employed to facilitate removal of passivation material, conductive material, and semiconductive material from between adjacent rows of pixels of the field emission array. A second mask is employed to facilitate the removal of passivation material and conductive material from the desired areas of pixel openings. The present invention also includes field emission arrays having a semiconductive grid and a relatively thin passivation layer exposed between adjacent row lines.
Information query
Patent Agency Ranking
0/0