A molded electrical interconnect having an electrical conductor embedded therein, a conductive terminal disposed in the cavity, a first end portion of the terminal disposed toward an open end of the cavity and a second end portion thereof coupled to a portion of the electrical conductor protruding into the cavity, the terminal is pivotally supported by a fulcrum near the second end portion thereof so that the first end portion of the terminal is movable in the cavity for alignment with a mating terminal.