Invention Grant
US06403418B2 Method of fabricating cup-shape cylindrical capacitor of high density DRAMs
有权
制造高密度DRAM的杯形圆柱形电容器的方法
- Patent Title: Method of fabricating cup-shape cylindrical capacitor of high density DRAMs
- Patent Title (中): 制造高密度DRAM的杯形圆柱形电容器的方法
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Application No.: US09551535Application Date: 2000-04-18
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Publication No.: US06403418B2Publication Date: 2002-06-11
- Inventor: Shiou-Yu Wang , Jia-Shyong Cheng , Tean-Sen Jen , Ming-Teng Hsieh
- Applicant: Shiou-Yu Wang , Jia-Shyong Cheng , Tean-Sen Jen , Ming-Teng Hsieh
- Priority: TW86106703A 19970729
- Main IPC: H01L218242
- IPC: H01L218242

Abstract:
A method of fabricating cup shape cylindrical capacitor of high density Dynamic Random Access Memory (DRAM) cells is disclosed. The cup shape capacitor shape is achieved by first depositing a first polysilicon layer on a silicon substrate; a third dielectric layer is then formed overlaying the first polysilicon layer, and defined third dielectric crowns by the conventional lithography and etching techniques; a second polysilicon layer is deposited overlaying the third dielectric crowns and first polysilicon layer; the first polysilicon and second polysilicon layers are then vertically anisotropically etchback to define storage nodes of the cylindrical capacitors; the third dielectric crowns are removed; finally, the capacitor dielectric layer and the polysilicon top plate of the capacitor are formed to complete the cup shape cylindrical capacitor formation for high density DRAM applications.
Public/Granted literature
- US20010036700A1 Method of fabricating cup-shape cylindrical capacitor of high density DRAMS Public/Granted day:2001-11-01
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