发明授权
US06405431B1 Method for manufacturing build-up multi-layer printed circuit board by using yag laser
有权
通过使用yag激光制造积层多层印刷电路板的方法
- 专利标题: Method for manufacturing build-up multi-layer printed circuit board by using yag laser
- 专利标题(中): 通过使用yag激光制造积层多层印刷电路板的方法
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申请号: US09467780申请日: 1999-12-20
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公开(公告)号: US06405431B1公开(公告)日: 2002-06-18
- 发明人: Dong Shin , Keon Yang Park , Young Hwan Shin , Byung Kook Sun , Jae Heun Joung
- 申请人: Dong Shin , Keon Yang Park , Young Hwan Shin , Byung Kook Sun , Jae Heun Joung
- 优先权: KR96-24640 19960627
- 主分类号: H01K310
- IPC分类号: H01K310
摘要:
A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.