公开(公告)号：US06405431B1

公开(公告)日：2002-06-18

申请号：US09467780

申请日：1999-12-20

申请人： Dong Shin ,  Keon Yang Park ,  Young Hwan Shin ,  Byung Kook Sun ,  Jae Heun Joung

发明人： Dong Shin ,  Keon Yang Park ,  Young Hwan Shin ,  Byung Kook Sun ,  Jae Heun Joung

IPC分类号： H01K310

CPC分类号： H05K3/4652 ,  H05K3/0035 ,  H05K3/0038 ,  H05K2201/0358 ,  H05K2201/09518 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.

摘要翻译： 公开了一种用于制造积层多层印刷电路板的方法，其中在多层印刷电路板中形成通孔时使用YAG激光器，使得其可以具有以下优点：制造 过程变得简单; 组件封装密度和板的设计自由度将得到改善; 并且可以确保信号处理的高速度。 用于制造积层多层印刷电路板的方法包括以下步骤：通过施加一般的光蚀刻工艺在覆铜层压板（CCL）上形成第一印刷电路图案，将具有铜箔的CCL 一面; 在其上形成有第一印刷电路图案的CCL上堆叠树脂涂覆（一面）铜箔（RCC），并加热并压制该结构; 用所述RCC将YAG激光照射到所述板上，以便通过去除所述RCC在预定位置形成通孔; 在其上形成有通孔的板上进行化学镀和电镀铜以形成镀层; 以及在所述镀层上形成第二印刷电路图案，以电连接形成有第一和第二印刷电路图案的层。

公开(公告)号：US6119335A

公开(公告)日：2000-09-19

申请号：US203489

申请日：1998-12-02

申请人： Keon Yang Park ,  Byung Kook Sun ,  Jae Heun Joung ,  Dong Shin

发明人： Keon Yang Park ,  Byung Kook Sun ,  Jae Heun Joung ,  Dong Shin

IPC分类号： H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/0038 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/108 ,  H05K3/0035 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A method for manufacturing a build-up multi-layer printed circuit board for use in computers, VTR, or portable telephones is disclosed, in which the method of forming a hole in a circuit layer and the method of forming a hole in an insulating layer are made different from each other by applying a combined formation method, thereby improving the formation precision and efficiency in forming the holes. Specifically, a resin-clad copper foil (RCC) is stacked on a CCL (copper-clad laminate) after forming a printed circuit layer, and this structure is heated and pressed. Then, beams of an Nd-YAG laser are irradiated to remove the copper-clad layer, and then beams of CO.sub.2 laser are irradiated to remove the residual resin insulator, thereby forming a via hole. Then, circuit patterns are formed on the board on which the via hole has been formed.

摘要翻译： 公开了一种制造用于计算机，VTR或便携式电话的积层多层印刷电路板的方法，其中在电路层中形成孔的方法和在绝缘层中形成孔的方法 通过组合形成方法彼此不同，从而提高了形成孔的形成精度和效率。 具体地，在形成印刷电路层之后，在CCL（覆铜层压板）上堆叠树脂包覆铜箔（RCC），并且对该结构进行加热和加压。 然后，照射Nd-YAG激光的光束以除去覆铜层，然后照射二氧化碳激光束以除去残留的树脂绝缘体，从而形成通孔。 然后，在已经形成通孔的板上形成电路图案。