Invention Grant
US06409463B1 Apparatuses and methods for adjusting a substrate centering system 有权
用于调整基板定心系统的装置和方法

  • Patent Title: Apparatuses and methods for adjusting a substrate centering system
  • Patent Title (中): 用于调整基板定心系统的装置和方法
  • Application No.: US09500399
    Application Date: 2000-02-08
  • Publication No.: US06409463B1
    Publication Date: 2002-06-25
  • Inventor: Brett J. CroftMichael Huston
  • Applicant: Brett J. CroftMichael Huston
  • Main IPC: B65G4907
  • IPC: B65G4907
Apparatuses and methods for adjusting a substrate centering system
Abstract:
Apparatuses and methods for use in adjusting a substrate centering system to center a substrate on a rotatable chuck in a semiconductor processing machine, the chuck including at least one reference point. One apparatus comprises a plate configured to be placed on the chuck and at least one centering mark formed on the plate, wherein the at least one centering mark is configured so that it may be compared to the at least one reference point on the chuck to determine if the plate is centered. The plate often is at least partially transparent so that its position relative to the at least one reference point on the chuck may be seen.
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