发明授权
- 专利标题: Method and apparatus for forming a uniform layer on a workpiece during sputtering
- 专利标题(中): 溅射期间在工件上形成均匀层的方法和装置
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申请号: US09362917申请日: 1999-07-27
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公开(公告)号: US06409890B1公开(公告)日: 2002-06-25
- 发明人: Howard E. Grunes , Zheng Xu , Praburam Gopalraja , John C. Forster , Ralf Hofmann , Anantha Subramani
- 申请人: Howard E. Grunes , Zheng Xu , Praburam Gopalraja , John C. Forster , Ralf Hofmann , Anantha Subramani
- 主分类号: C23C1435
- IPC分类号: C23C1435
摘要:
Embodiments include devices and methods for sputtering material onto a workpiece in a chamber which includes a plasma generation area and a target. A coil is positioned to inductively couple energy into the plasma generation area to generate a plasma. A body is positioned between the workpiece and the target to prevent an amount of target material from being sputtered onto the workpiece. The body prevents an amount of target material from being sputtered onto the workpiece. The body may act as a dark space shield and inhibit plasma formation between the body and the target. The body may also act as a physical shield to block sputtered material from accumulating on the workpiece.
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