发明授权
US06409890B1 Method and apparatus for forming a uniform layer on a workpiece during sputtering 失效
溅射期间在工件上形成均匀层的方法和装置

Method and apparatus for forming a uniform layer on a workpiece during sputtering
摘要:
Embodiments include devices and methods for sputtering material onto a workpiece in a chamber which includes a plasma generation area and a target. A coil is positioned to inductively couple energy into the plasma generation area to generate a plasma. A body is positioned between the workpiece and the target to prevent an amount of target material from being sputtered onto the workpiece. The body prevents an amount of target material from being sputtered onto the workpiece. The body may act as a dark space shield and inhibit plasma formation between the body and the target. The body may also act as a physical shield to block sputtered material from accumulating on the workpiece.
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