发明授权
- 专利标题: Sputtering device
- 专利标题(中): 溅射装置
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申请号: US09599531申请日: 2000-06-23
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公开(公告)号: US06413392B1公开(公告)日: 2002-07-02
- 发明人: Tsuyoshi Sahoda , Toshimitsu Uehigashi , Yasushi Higuchi , Kuniaki Nakajima , Tomoyasu Kondo
- 申请人: Tsuyoshi Sahoda , Toshimitsu Uehigashi , Yasushi Higuchi , Kuniaki Nakajima , Tomoyasu Kondo
- 优先权: JP11-177810 19990624; JP2000-181672 20000616
- 主分类号: C23C1435
- IPC分类号: C23C1435
摘要:
A sputtering device that efficiently guides sputtering particles ejected from a target to a film deposition subject and prolongs the interval at which a stick preventive member requires replacement. The sputtering device 1 has a vacuum chamber in which a specified sputtering target is placed so as to face a substrate 4 that is also placed in the vacuum chamber 2, and deposits a film on a surface of the substrate 4 using sputtering particles 20 ejected from the sputtering target 6; and particle ejection sections 60 constructed so as to slope at a specified angle of 30° to 60° with respect to the surface of the substrate 4, and respectively facing each other in the shape of a funnel are provided on the sputtering target 6. Lines of magnetic force 13 run from an N pole of a magnet 7a arranged at a rear surface of the target 6 to an S pole of a magnet 7b arranged around the target 6.