发明授权
US06413848B1 Self-aligned fuse structure and method with dual-thickness dielectric
有权
自对准保险丝结构和双层电介质的方法
- 专利标题: Self-aligned fuse structure and method with dual-thickness dielectric
- 专利标题(中): 自对准保险丝结构和双层电介质的方法
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申请号: US09534907申请日: 2000-03-23
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公开(公告)号: US06413848B1公开(公告)日: 2002-07-02
- 发明人: Gary K. Giust , Ruggero Castagnetti , Yauh-Ching Liu , Subramanian Ramesh
- 申请人: Gary K. Giust , Ruggero Castagnetti , Yauh-Ching Liu , Subramanian Ramesh
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
Provided are a self-aligned semiconductor fuse structure, a method of making such a fuse structure, and apparatuses incorporating such a fuse structure. The fuse break point, that point at which the electrical link of which the fuse is part is severed by a laser beam, is self-aligned by the use of photolithographically patterned anti-reflective dielectric coatings. The self-alignment allows the size location of the break point to be less sensitive to the laser beam size and alignment. This has several advantages including allowing photolithographic control and effective size reduction of the laser spot irradiating the fuse material and surrounding structure. This permits reduced fuse pitch, increasing density and the efficiency of use of chip area, and results in reduced thermal exposure, which causes less damage to chip. In addition, laser alignment is less critical and therefore less timely, which increases throughput in fabrication.
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