发明授权
- 专利标题： Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices
- 专利标题（中）： 用于监测半导体器件的处理表面的形状和用于制造半导体器件的设备的方法
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申请号： US09846372申请日： 2001-05-02
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公开(公告)号： US06414499B2公开(公告)日： 2002-07-02
- 发明人: Hiroyuki Yano , Katsuya Okumura
- 申请人： Hiroyuki Yano , Katsuya Okumura
- 优先权： JP10-107689 19980417
- 主分类号： G02R31308
- IPC分类号： G02R31308
摘要：
An equipment for manufacturing semiconductor devices, comprises a processing tool which processes a to-be-processed surface of a semiconductor workpiece to a target shape, a monitor which three-dimensionally monitors a shape of a processed surface of the semiconductor workpiece while the semiconductor workpiece is set in the processing tool, and a controller which controls the processing tool in a feedback manner on the basis of the shape of the processed surface monitored by the monitor. If the shape of the processed surface deviates from the target shape, the controller adjusts process conditions of the processing tool so that the target shape can be obtained.
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