公开(公告)号：US06414499B2

公开(公告)日：2002-07-02

申请号：US09846372

申请日：2001-05-02

申请人： Hiroyuki Yano ,  Katsuya Okumura

发明人： Hiroyuki Yano ,  Katsuya Okumura

IPC分类号： G02R31308

CPC分类号： H01L22/26 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An equipment for manufacturing semiconductor devices, comprises a processing tool which processes a to-be-processed surface of a semiconductor workpiece to a target shape, a monitor which three-dimensionally monitors a shape of a processed surface of the semiconductor workpiece while the semiconductor workpiece is set in the processing tool, and a controller which controls the processing tool in a feedback manner on the basis of the shape of the processed surface monitored by the monitor. If the shape of the processed surface deviates from the target shape, the controller adjusts process conditions of the processing tool so that the target shape can be obtained.

摘要翻译： 一种用于制造半导体器件的设备，包括将半导体工件的待处理表面处理为目标形状的处理工具，在半导体工件的三维监视半导体工件的加工表面的形状的监视器 设置在处理工具中，以及控制器，其基于由监视器监视的处理表面的形状以反馈方式控制处理工具。 如果处理后的表面的形状偏离目标形状，则控制器调整加工工具的工艺条件，从而可以获得目标形状。