An antistatic strapping apparatus for binding and securing a plurality of semiconductor device carrier trays, the apparatus including a strap member having opposed ends and a side defined as a top side spaced from a side defined as a bottom side and a major surface defined by the opposed ends and top and bottom sides. A loop portion of a hook and loop fastening combination constitutes the major surface area on the top side of the strap member. A piece of hook portion having the same width as the strap member of the book and loop fastening combination secured to the top side at a first end of the strap member, the hook portion extending the length of the strap member by at least about 80 mm. A conductive thread is sewn in a multiplicity of lengthwise tracks on the second side of the major surface to prevent build-up of static electricity. A “L” shaped buckle having a first transverse slot formed therethrough and near the end of the shorter leg, and a second transverse slot formed therethrough and near the end of the longer leg. The second end of the strap member is inserted through first slot of the “L” shaped buckle and folded back to itself, the bottom surface contain conductive thread tracks facing out, is sewn to secure the second end to the “L” shaped buckle.