摘要:
There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).
摘要:
An arrangement of three plates where the top plate interfaces with the BGA device, the center plate has a structure of channels or openings which is matched with the size and ball pitch of the BGA device that is being handled while the bottom plate interfaces with the tester or target plate. A plurality of center plates is provided to match and equal the plurality of BGA devices that is handled in the BGA testing or BGA semiconductor-manufacturing environment.
摘要:
There is provided an earphone comprising a housing having a fist and a second end. The housing has a first opening at the first end and a second opening at the second end for receiving an electroacoustic reproduction transducer. The earphone further has a second pressure reducing unit which is placed over the second opening to reduce the dynamic water pressure on the second opening, and a first pressure reducing unit which is placed over the first opening to reduce the dynamic water pressure on the first opening. In addition a second water-tight but acoustically transparent film is provided in the interior of the housing over the second opening to water-tightly close the second opening. A first water-tight but acoustically transparent film is placed in the interior of the housing over the first hole to water-tightly close the first hole.
摘要:
There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).
摘要:
A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
摘要:
An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.
摘要:
A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
摘要:
An antistatic strapping apparatus for binding and securing a plurality of semiconductor device carrier trays, the apparatus including a strap member having opposed ends and a side defined as a top side spaced from a side defined as a bottom side and a major surface defined by the opposed ends and top and bottom sides. A loop portion of a hook and loop fastening combination constitutes the major surface area on the top side of the strap member. A piece of hook portion having the same width as the strap member of the hook and loop fastening combination secured to the top side at a first end of the strap member, the hook portion extending the length of said strap member by at least about 80 mm. A conductive thread is sewn in a multiplicity of lengthwise tracks on said second side of said major surface to prevent build-up of static electricity. A “L” shaped buckle having a first transverse slot formed therethrough and near the end of the longer leg, and a second transverse slot formed therethrough and near the end of the shorter leg. The second end of the strap member is inserted through first slot of the “L” shaped buckle and folded back to itself, the bottom surface contain conductive thread tracks facing out, is sewn to secure the second end to the “L” shaped buckle.
摘要:
An apparatus for quickly and reliably aligning a semiconductor handling apparatus with a semiconductor tester. Two docking plates are attached, one to the device handler and one to the device tester. On the docking plates a substructure is mounted which first allows initial alignment of the handler plate with the test head plate after which the substructure provides the means of securely positioning and interlocking the handler plate with the test head.
摘要:
There is provided an in-ear earphone comprising a housing (100), a transducer housing (200) and a support unit (300). The transducer housing (200) serves to receive an electroacoustic transducer. The support unit (300) is connected to the housing (100) and is adapted to be anchored in a concha of a wearer. The support unit (300) is at least partially made from a soft flexible material. In that way it can be ensured that the in-ear earphone can be anchored in any concha of a wearer.