In-ear earpiece and expansion adaptor
    1.
    发明授权
    In-ear earpiece and expansion adaptor 有权
    入耳式耳机和扩展适配器

    公开(公告)号:US08897480B2

    公开(公告)日:2014-11-25

    申请号:US13063915

    申请日:2009-09-15

    IPC分类号: H04R25/00 H04R1/10

    摘要: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).

    摘要翻译: 提供了一种入耳式耳机,其具有用于接收电声换能器的壳体(50)和耦合到入耳式耳机的壳体(50)的扩展适配器单元(20)。 膨胀适配器单元(20)具有膨胀单元(20),其具有上部(26),所述上部具有用于装配到用于使用者的耳朵的叛逆性抗原,反螺旋和/或耳状物的曲率。 膨胀适配器单元还具有用于将上部(26)连接到入耳式耳机的壳体(50)的至少一个联接元件,其中,膨胀单元(20)具有至少两个柔性支腿(22,25) 作为联接元件,其中一个腿部(22)联接到上部部分(26)的第一端部(28)并且第二腿部(25)联接到上部部分(26)的第二端部(29)。

    Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
    2.
    发明授权
    Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system 有权
    用于在球栅阵列处理器和球栅阵列测试系统之间进行接口的可靠方法和装置

    公开(公告)号:US06300781B1

    公开(公告)日:2001-10-09

    申请号:US09182762

    申请日:1998-10-30

    IPC分类号: G01R3126

    CPC分类号: H05K7/1061 G01R1/0483

    摘要: An arrangement of three plates where the top plate interfaces with the BGA device, the center plate has a structure of channels or openings which is matched with the size and ball pitch of the BGA device that is being handled while the bottom plate interfaces with the tester or target plate. A plurality of center plates is provided to match and equal the plurality of BGA devices that is handled in the BGA testing or BGA semiconductor-manufacturing environment.

    摘要翻译: 顶板与BGA装置接合的三个板的布置,中间板具有与底板与测试仪接口的正在处理的BGA装置的尺寸和球距相匹配的通道或开口的结构 或靶板。 提供多个中心板以匹配并等于在BGA测试或BGA半导体制造环境中处理的多个BGA器件。

    EARPHONE
    3.
    发明申请
    EARPHONE 审中-公开
    耳机

    公开(公告)号:US20120269375A1

    公开(公告)日:2012-10-25

    申请号:US13391959

    申请日:2010-08-24

    IPC分类号: H04R1/10

    摘要: There is provided an earphone comprising a housing having a fist and a second end. The housing has a first opening at the first end and a second opening at the second end for receiving an electroacoustic reproduction transducer. The earphone further has a second pressure reducing unit which is placed over the second opening to reduce the dynamic water pressure on the second opening, and a first pressure reducing unit which is placed over the first opening to reduce the dynamic water pressure on the first opening. In addition a second water-tight but acoustically transparent film is provided in the interior of the housing over the second opening to water-tightly close the second opening. A first water-tight but acoustically transparent film is placed in the interior of the housing over the first hole to water-tightly close the first hole.

    摘要翻译: 提供了一种耳机,其包括具有拳头和第二端的壳体。 壳体在第一端具有第一开口,在第二端具有用于接收电声再现换能器的第二开口。 所述耳机还具有第二减压单元,所述第二减压单元放置在所述第二开口上方以减小所述第二开口处的动态水压;以及第一减压单元,其放置在所述第一开口上方以减小所述第一开口上的动态水压力 。 此外,在第二开口的壳体的内部设置第二水密但声透明的膜,以水密地闭合第二开口。 将第一个水密但声透明的薄膜放置在壳体内部的第一个孔上,以水密地闭合第一个孔。

    In-ear Earpiece and Expansion Adaptor
    4.
    发明申请
    In-ear Earpiece and Expansion Adaptor 有权
    入耳式耳机和扩展适配器

    公开(公告)号:US20110255729A1

    公开(公告)日:2011-10-20

    申请号:US13063915

    申请日:2009-09-15

    IPC分类号: H04R25/00

    摘要: There is provided an in-ear earphone having a housing (50) for receiving an electroacoustic transducer and an expansion adaptor unit (20) which is coupled to the housing (50) of the in-ear earphone. The expansion adaptor unit (20) has an expansion unit (20) with an upper portion (26) having a curvature for fitting into a crus inferius anthelicis, an anti-helix and/or a concha of an ear of a user. The expansion adaptor unit further has at least one coupling element for coupling the upper portion (26) to the housing (50) of the in-ear earphone, wherein the expansion unit (20) has at least two flexible legs (22, 25) as coupling elements, wherein one leg (22) is coupled to a first end (28) of the upper portion (26) and a second leg (25) is coupled to a second end (29) of the upper portion (26).

    摘要翻译: 提供了一种入耳式耳机,其具有用于接收电声换能器的壳体(50)和耦合到入耳式耳机的壳体(50)的扩展适配器单元(20)。 膨胀适配器单元(20)具有膨胀单元(20),其具有上部(26),所述上部具有用于装配到用于使用者的耳朵的叛逆性抗原,反螺旋和/或耳状物的曲率。 膨胀适配器单元还具有用于将上部(26)连接到入耳式耳机的壳体(50)的至少一个联接元件,其中,膨胀单元(20)具有至少两个柔性支腿(22,25) 作为联接元件,其中一个腿部(22)联接到上部部分(26)的第一端部(28)并且第二腿部(25)联接到上部部分(26)的第二端部(29)。

    Testing of BGA and other CSP packages using probing techniques
    5.
    发明授权
    Testing of BGA and other CSP packages using probing techniques 有权
    使用探测技术测试BGA和其他CSP封装

    公开(公告)号:US06791346B2

    公开(公告)日:2004-09-14

    申请号:US10140573

    申请日:2002-05-08

    IPC分类号: G01R3102

    CPC分类号: G01R31/2887

    摘要: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

    摘要翻译: 一种在测试这些设备时处理小型半导体器件的方法和装置。 多个装置安装在装置带状载体内并且位于测试位置。 使用装置带载体对准工具执行装置带状载体的这种定位; 装置带载体可以容易地相对于测试头/探针卡重新定位,以测试包含在装置带状载体内的多个装置。

    BGA device positioner kit
    6.
    发明授权
    BGA device positioner kit 失效
    BGA器件定位器套件

    公开(公告)号:US06433564B1

    公开(公告)日:2002-08-13

    申请号:US09332380

    申请日:1999-06-14

    IPC分类号: G01R3102

    CPC分类号: G01R1/0483

    摘要: An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.

    摘要翻译: 描述了一种装置,其允许准确和快速地定位用于球栅阵列插座的半导体器件制造和测试应用中的输入梭,输出梭,对接板,热板和测试台的装置套件。 突出了一种方法,通过这种方法,这些梭子和板中的插座可以适应于不同尺寸和不同类型的半导体器件。 描述的拾取轴在半导体器件制造和测试环境中增加了灵活性。

    Testing of BGA and other CSP packages using probing techniques
    7.
    发明授权
    Testing of BGA and other CSP packages using probing techniques 有权
    使用探测技术测试BGA和其他CSP封装

    公开(公告)号:US06404212B1

    公开(公告)日:2002-06-11

    申请号:US09252629

    申请日:1999-02-18

    IPC分类号: G01R3102

    CPC分类号: G01R31/2887

    摘要: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

    摘要翻译: 一种在测试这些设备时处理小型半导体器件的方法和装置。 多个装置安装在装置带状载体内并且位于测试位置。 使用装置带载体对准工具执行装置带状载体的这种定位; 装置带载体可以容易地相对于测试头/探针卡重新定位,以测试包含在装置带状载体内的多个装置。

    Hook and loop fastener strapping for semiconductor carrying trays
    8.
    发明授权
    Hook and loop fastener strapping for semiconductor carrying trays 有权
    用于半导体托盘的钩和环紧固件捆扎

    公开(公告)号:US06176066B1

    公开(公告)日:2001-01-23

    申请号:US09307838

    申请日:1999-05-10

    IPC分类号: B65B1302

    CPC分类号: H01L21/67333 Y02P80/30

    摘要: An antistatic strapping apparatus for binding and securing a plurality of semiconductor device carrier trays, the apparatus including a strap member having opposed ends and a side defined as a top side spaced from a side defined as a bottom side and a major surface defined by the opposed ends and top and bottom sides. A loop portion of a hook and loop fastening combination constitutes the major surface area on the top side of the strap member. A piece of hook portion having the same width as the strap member of the hook and loop fastening combination secured to the top side at a first end of the strap member, the hook portion extending the length of said strap member by at least about 80 mm. A conductive thread is sewn in a multiplicity of lengthwise tracks on said second side of said major surface to prevent build-up of static electricity. A “L” shaped buckle having a first transverse slot formed therethrough and near the end of the longer leg, and a second transverse slot formed therethrough and near the end of the shorter leg. The second end of the strap member is inserted through first slot of the “L” shaped buckle and folded back to itself, the bottom surface contain conductive thread tracks facing out, is sewn to secure the second end to the “L” shaped buckle.

    摘要翻译: 一种用于捆绑和固定多个半导体器件托盘的抗静电捆扎装置,该装置包括带状构件,该带构件具有相对的端部和限定为被限定为底侧的侧面的顶侧和由相对的端部限定的主表面 端部和顶部和底部。 钩和环紧固组合的环部分构成带构件的顶侧上的主要表面区域。 具有与钩环紧固组件的带构件相同的宽度的一个钩部分固定到带构件的第一端处的顶侧,钩部将所述带构件的长度延伸至少约80mm 。 导电线缝合在所述主表面的所述第二侧上的多个纵向轨道中以防止静电积聚。 一个“L”形的带扣,其具有穿过其中形成的第一横向狭槽,并且在较长的腿部的端部附近,以及形成在其中并靠近短腿的端部的第二横向槽口。 带状构件的第二端通过“L”形带扣的第一槽插入并折叠回自身,底面包含面向外的导电线迹,缝合以将第二端固定到“L”形扣环。

    Universal Docking System
    9.
    发明授权
    Universal Docking System 有权
    通用对接系统

    公开(公告)号:US06271658B1

    公开(公告)日:2001-08-07

    申请号:US09174620

    申请日:1998-10-19

    IPC分类号: G01R104

    摘要: An apparatus for quickly and reliably aligning a semiconductor handling apparatus with a semiconductor tester. Two docking plates are attached, one to the device handler and one to the device tester. On the docking plates a substructure is mounted which first allows initial alignment of the handler plate with the test head plate after which the substructure provides the means of securely positioning and interlocking the handler plate with the test head.

    摘要翻译: 一种用于将半导体处理装置与半导体测试仪快速且可靠地对准的装置。 连接两个对接板,一个连接到设备处理器,一个连接到设备测试仪。 在对接板上,安装了底座,其首先允许处理器板与测试头板的初始对准,之后底座提供了将操纵板与测试头牢固地定位和互锁的手段。

    IN-EAR HEADPHONE AND HEADSET
    10.
    发明申请
    IN-EAR HEADPHONE AND HEADSET 审中-公开
    耳塞耳塞和耳机

    公开(公告)号:US20110002498A1

    公开(公告)日:2011-01-06

    申请号:US12747144

    申请日:2008-12-15

    IPC分类号: H04R1/10

    摘要: There is provided an in-ear earphone comprising a housing (100), a transducer housing (200) and a support unit (300). The transducer housing (200) serves to receive an electroacoustic transducer. The support unit (300) is connected to the housing (100) and is adapted to be anchored in a concha of a wearer. The support unit (300) is at least partially made from a soft flexible material. In that way it can be ensured that the in-ear earphone can be anchored in any concha of a wearer.

    摘要翻译: 提供了一种入耳式耳机,其包括壳体(100),换能器壳体(200)和支撑单元(300)。 换能器壳体(200)用于接收电声换能器。 支撑单元(300)连接到壳体(100)并且适于被锚定在佩戴者的外耳中。 支撑单元(300)至少部分地由软柔性材料制成。 以这种方式,可以确保入耳式耳机可以锚定在佩戴者的任何外耳中。