发明授权
- 专利标题: Multilayer circuit structure build up method
- 专利标题(中): 多层电路结构建立方法
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申请号: US09429854申请日: 1999-10-28
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公开(公告)号: US06428942B1公开(公告)日: 2002-08-06
- 发明人: Hunt Hang Jiang , Yasuhito Takahashi , Michael Guang-Tzong Lee , Wen-chou Vincent Wang , Mark McCormack
- 申请人: Hunt Hang Jiang , Yasuhito Takahashi , Michael Guang-Tzong Lee , Wen-chou Vincent Wang , Mark McCormack
- 主分类号: G03F700
- IPC分类号: G03F700
摘要:
Methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes at least partially through a multilayer circuit structure. The formed multilayer circuit structures can occupy less space than corresponding multilayer circuit structures with stacked via structures.