A system for verifying the integrity of components moving within a material handling system ensures that only components of acceptable integrity and condition are allowed to move onto the processing locations of a semiconductor plant. In an example embodiment, components that are warped or cracked are initially detected and scanned by a beam break system and/or an optical system. An integrity verification assessment is made immediately on the component to determine whether the scanned component meets with a predefined baseline parameter or characteristic. The components that do not pass integrity verification are then removed from the material handling system while the components that pass move on to the first processing location.