发明授权
- 专利标题: Apparatus for and method of polishing workpiece
- 专利标题(中): 抛光工件的设备及方法
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申请号: US09499472申请日: 2000-02-07
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公开(公告)号: US06432258B1公开(公告)日: 2002-08-13
- 发明人: Norio Kimura , Hozumi Yasuda
- 申请人: Norio Kimura , Hozumi Yasuda
- 优先权: JP7-287976 19951009; JP8-50956 19960214
- 主分类号: C23F102
- IPC分类号: C23F102
摘要:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. A guide ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.