A semiconductor device includes a substrate, an external connection terminal, a penetrating outer moat in a doughnut form, a first interconnection, a second interconnection and a conductor. The outer moat is formed in a portion of the substrate which surrounds the external connection terminal. The first interconnection is provided on one-surface side of the substrate which is surrounded by the outer moat and electrically connected to the external connection terminal. The second interconnection is provided on one-surface side of the semiconductor chip which lies outside the outer moat and electrically connected to an internal circuit. The conductor has a bent portion and electrically connects the first and second interconnections to each other.