- 专利标题: Method of fabricating thermoelectric device
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申请号: US09752695申请日: 2001-01-03
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公开(公告)号: US06441296B2公开(公告)日: 2002-08-27
- 发明人: Hisato Hiraishi , Shigeru Watanabe
- 申请人: Hisato Hiraishi , Shigeru Watanabe
- 优先权: JP8-304846 19961115
- 主分类号: H01L3534
- IPC分类号: H01L3534
摘要:
The invention provides a method of fabricating a thermoelectric device, whereby a grooved block composed of n-type thermoelectric semiconductor and a grooved block composed of p-type thermoelectric semiconductor, provided with a plurality of grooves formed therein, respectively, at a same pitch and parallel with each other, are formed such that a depthwise portion of respective grooved blocks is left intact, and then, an integrated block is formed by fitting and adhering together the grooved blocks composed of the n-type and p-type thermoelectric semiconductors, respectively, filling up gaps in fitting parts with adhesive insulation members. After removing portions of the integrated block, other than the fitting parts where the n-type and p-type thermoelectric semiconductors are fitted to each other, n-type and p-type thermoelectric semiconductor pieces are exposed, and by forming electrodes for connecting the pieces to each other alternately and in series, the thermoelectric device is completed.
公开/授权文献
- US20010001961A1 Method of fabricating thermoelectric device 公开/授权日:2001-05-31
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