公开(公告)号：US06444893B1

公开(公告)日：2002-09-03

申请号：US09593019

申请日：2000-06-13

申请人： Katsuhiko Onoue ,  Toshiharu Hoshi

发明人： Katsuhiko Onoue ,  Toshiharu Hoshi

IPC分类号： H01L3534

CPC分类号： H01L35/30 ,  H01L35/04

摘要： A thermoelectric module includes n-type semiconductor columns and p-type semiconductor columns connected in series through metal electrodes formed on inner surfaces of a pair of electrically insulating substrates, and the semiconductor columns are arranged so dense that the total cross sections of the semiconductor columns occupy at least 42 percent of one of the inner surfaces, whereby the converting efficiency is improved by virtue of restriction of the convective heat transfer between the electrically insulating substrates.

摘要翻译： 热电模块包括通过形成在一对电绝缘基板的内表面上的金属电极串联连接的n型半导体柱和p型半导体柱，并且半导体柱布置得如此致密，使得半导体柱的总横截面 占据内表面之一的至少42％，由此通过限制电绝缘基板之间的对流热传递来提高转换效率。

公开(公告)号：US06376763B2

公开(公告)日：2002-04-23

申请号：US09733799

申请日：2000-12-08

申请人： Ryoji Funahashi ,  Ichiro Matsubara ,  Satoshi Sodeoka

发明人： Ryoji Funahashi ,  Ichiro Matsubara ,  Satoshi Sodeoka

IPC分类号： H01L3534

CPC分类号： C01G51/68 ,  C01P2002/34 ,  C01P2002/54 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2006/32 ,  C01P2006/40 ,  H01B1/08 ,  H01L35/20 ,  H01L35/22

摘要： This invention provides a complex oxide comprising the features of: (i) being represented by the formula: Ca3-xRExCo4Oy wherein RE is a rare earth element, 0≦x≦0.5 and 8.5≦y≦10, (ii) having a Seebeck coefficient of 100 &mgr;V/K or more at a temperature of 300° C. or higher, and (iii) having an electric conductivity of 103 S/m or more at a temperature of 300° C. or higher. The complex oxide is composed of low-toxicity elements, excellent in heat resistance and chemical durability and high in thermoelectric conversion efficiency.

摘要翻译： 本发明提供一种复合氧化物，其包括以下特征：（i）由下式表示：Ca 3-x R Ex Co 4 O y其中RE为稀土元素，0≤x≤0.5且8.5≤y≤10，（ii） 在300℃以上的温度下具有100μV/ K以上的塞贝克系数，（iii）在300℃以上的温度下具有103S / m以上的电导率。 复合氧化物由低毒元素组成，耐热性和化学耐久性优异，热电转换效率高。

公开(公告)号：US06255579B1

公开(公告)日：2001-07-03

申请号：US09547178

申请日：2000-04-11

申请人： Martinho R. Pais ,  Petr Kacena ,  Vinh Dinh Dino Trinh ,  John M. Smith

发明人： Martinho R. Pais ,  Petr Kacena ,  Vinh Dinh Dino Trinh ,  John M. Smith

IPC分类号： H01L3534

CPC分类号： H01L23/34 ,  H01J29/98 ,  H01J2229/0061 ,  H01L2924/0002 ,  Y10S165/048 ,  H01L2924/00

摘要： Embedded electronics (102) are operated under normal operating conditions, with power being supplied to embedded electronics via a power source (205). Heat is generated via the normal operation of the embedded electronics (102), and a voltage (117) is generated via thermionic emission from the heat. The voltage (117) that is generated is supplied to the power source (205) to help power the embedded electronics (102).

摘要翻译： 嵌入式电子设备（102）在正常操作条件下运行，电源通过电源（205）提供给嵌入式电子设备。 通过嵌入式电子设备（102）的正常操作产生热量，并且通过来自热的热电子发射产生电压（117）。 所产生的电压（117）被提供给电源（205）以帮助为嵌入式电子设备（102）供电。

公开(公告)号：US06207887B1

公开(公告)日：2001-03-27

申请号：US09349428

申请日：1999-07-07

申请人： John C. Bass ,  Norbert B. Elsner

发明人： John C. Bass ,  Norbert B. Elsner

IPC分类号： H01L3534

CPC分类号： H01L35/32 ,  H01L35/34

摘要： A miniature thermoelectric module for generating electric power from low power heat sources in the range of a fraction of a Watt to a few Watts. The module comprises an array of thermoelectric elements, each element having a cross section of less than 0.001 square inch and a length of at least 0.25 inch. The elements are separated from each other with a polyimide insulator sheet in a checkerboard array. In a preferred embodiment, the modules are fabricated by hot pressing a stack of alternating plates of p and n doped thin plates all separated by thin sheets of a polyimide insulator material to produce a pressed stack of p and n doped layers. The stack is then sliced to produce layered plates which are then stacked with insulating polyimide layers positioned between the layered plates to produce the checkerboard array of p and n thermoelectric elements. Contacts are applied to electrically connect all of the elements. In a preferred embodiment, the contacts are applied by first sputtering a thin layer of gold, then welding gold tabs, and then blasting away the excess sputtered gold. In one preferred embodiment, the contacts connect all of the elements in series. In another preferred embodiment, the elements are connected in a series-parallel circuit. In a preferred embodiment, the module is utilized in a generation unit with a 1-Watt radioactive heat source to produce about 40 mW of electric power at 5.5 Volts which is converted to 12 Volts with a DC to DC converter.

摘要翻译： 一种微型热电模块，用于从几瓦特到几瓦的范围内的低功率热源产生电力。 该模块包括一组热电元件，每个元件具有小于0.001平方英寸的横截面和至少0.25英寸的长度。 这些元件用棋盘阵列中的聚酰亚胺绝缘片彼此分离。 在优选实施例中，通过热压由p和n掺杂的薄板的交替板堆叠而制成的模块，所有这些交替的板均由聚酰亚胺绝缘体材料的薄片隔开，以产生压制的p和n掺杂层。 然后将叠层切片以产生层压板，然后层叠板，其中层叠有位于层压板之间的绝缘聚酰亚胺层，以产生p和n热电元件的棋盘阵列。 应用触点以电连接所有元件。 在优选实施例中，通过首先溅射薄金层来施加触点，然后焊接金片，然后将多余的溅射金喷出。 在一个优选实施例中，触点将所有元件串联连接。 在另一优选实施例中，元件以串并联电路连接。 在优选实施例中，该模块用于具有1瓦放射性热源的发电单元中，以5.5伏特产生约40mW的电力，其用DC-DC转换器转换为12伏特。

公开(公告)号：US06743973B2

公开(公告)日：2004-06-01

申请号：US09996669

申请日：2001-11-29

申请人： Takahiro Hayashi ,  Yuma Horio ,  Toshiharu Hoshi

发明人： Takahiro Hayashi ,  Yuma Horio ,  Toshiharu Hoshi

IPC分类号： H01L3534

CPC分类号： H01L35/34 ,  C22C12/00 ,  C22C28/00 ,  C22F1/002 ,  C22F1/16 ,  H01L35/16 ,  H01L35/18

摘要： Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0×10−3/K.

摘要翻译： （Bi，Sb）（Te，Se）体系的热电材料通过液体淬火法和从具有入口部分和出口部分的模具单元挤出30-150度来制造，使得晶粒具有 平均晶粒尺寸等于或小于30微米，（001）平面大致平行于电流流动的方向定向，从而实现品质因数等于或大于3.0×10 -3 / K。

公开(公告)号：US06743972B2

公开(公告)日：2004-06-01

申请号：US09927276

申请日：2001-08-10

申请人： Chris Macris

发明人： Chris Macris

IPC分类号： H01L3534

CPC分类号： H01L35/04 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/49816 ,  H01L35/32 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  Y10S257/93

摘要： Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.

摘要翻译： 包括至少一个IC芯片的散热IC器件包括具有利用热电效应以更有效地从电子电路散发热能的电路的半导体衬底。

公开(公告)号：US06580025B2

公开(公告)日：2003-06-17

申请号：US09921954

申请日：2001-08-03

申请人： James K Guy

发明人： James K Guy

IPC分类号： H01L3534

CPC分类号： F24F5/0042 ,  H01L35/30

摘要： A thermoelectric device adaptable for heating and for cooling a fluid such as air. The device includes at least one thermoelectric module and at least one rotating heat sink that transfer heat between the thermoelectric module(s) and the fluid. The heat sink(s) are mounted on a shaft and include a plurality of thermally conductive impeller blades. The thermoelectric module(s) rotate with the heat sink(s) about the shaft. Because the thermoelectric module(s) are in direct contact with the thermally conductive impeller, heat is transferred more efficiently into and out of the thermoelectric device. Because the impeller blades also act as heat sinks, fewer components are needed than with conventional devices.

摘要翻译： 适用于加热和冷却诸如空气的流体的热电装置。 该装置包括至少一个热电模块和至少一个在热电模块和流体之间传递热量的旋转散热器。 散热器安装在轴上并且包括多个导热叶轮叶片。 热电模块随着散热器绕轴旋转。 由于热电模块与导热叶轮直接接触，所以热量更有效地传入和传出热电装置。 由于叶轮叶片也起到散热器的作用，因此与常规设备相比，需要更少的部件。

公开(公告)号：US06441295B2

公开(公告)日：2002-08-27

申请号：US09752693

申请日：2001-01-03

申请人： Hisato Hiraishi ,  Shigeru Watanabe

发明人： Hisato Hiraishi ,  Shigeru Watanabe

IPC分类号： H01L3534

CPC分类号： H01L35/34 ,  H01L35/32

摘要： The invention provides a method of fabricating a thermoelectric device, whereby a grooved block composed of n-type thermoelectric semiconductor and a grooved block composed of p-type thermoelectric semiconductor, provided with a plurality of grooves formed therein, respectively, at a same pitch and parallel with each other, are formed such that a depthwise portion of respective grooved blocks is left intact, and then, an integrated block is formed by fitting and adhering together the grooved blocks composed of the n-type and p-type thermoelectric semiconductors, respectively, filling up gaps in fitting parts with adhesive insulation members. After removing portions of the integrated block, other than the fitting parts where the n-type and p-type thermoelectric semiconductors are fitted to each other, n-type and p-type thermoelectric semiconductor pieces are exposed, and by forming electrodes for connecting the pieces to each other alternately and in series, the thermoelectric device is completed.

摘要翻译： 本发明提供一种制造热电装置的方法，由此形成由n型热电半导体构成的开槽块和由p型热电半导体构成的开槽块，分别以相同的间距形成有多个槽， 彼此平行地形成为使得相应的开槽块的深度部分保持不变，然后通过将由n型和p型热电半导体构成的开槽块嵌合在一起而形成一体化块 填充与粘合绝缘构件配合零件的间隙。 除去除了n型和p型热电半导体彼此嵌合的嵌合部以外的积分块的部分，露出n型和p型热电半导体片，并且通过形成用于连接 交替地并串联连接，热电装置完成。

公开(公告)号：US06340787B1

公开(公告)日：2002-01-22

申请号：US09319128

申请日：2000-01-03

申请人： Janick Simeray ,  Pascal Laligant

发明人： Janick Simeray ,  Pascal Laligant

IPC分类号： H01L3534

CPC分类号： H01L35/32 ,  G04C10/00 ,  H01L35/30 ,  H02M3/338

摘要： An energy converting circuit, boosting the voltage supplied by a low direct voltage source, comprising a self-oscillating circuit, operating at very low voltage, using a voltage boosting transformer generating control signals of two chopper-boosters operating alternately. The circuit including an enhancement-type field effect translator used in synchronous switching with the self-oscillating circuit, which is in serial connection with an inductive resistor to the terminals of the source (1). The transistor being connected to a user circuit via a diode (15, 16). The circuit is used in a device for supplying electricity to appliances and by the production of thermal converters for the utilization of low-voltage thermoelectricity, as well as in a method for the manufacture of thermal converters on an industrial scale.

摘要翻译： 一种能量转换电路，其使用升压变压器产生由两个斩波增压器交替运行的控制信号，提升由低直流电压源提供的电压，该电压包括以非常低的电压工作的自振荡电路。 该电路包括用于与自振荡电路同步切换的增强型场效应转换器，该自振荡电路与电感电阻器（1）的端子串联连接。 晶体管经由二极管（15,16）连接到用户电路。 该电路用于向家用电器供电的设备，以及生产用于低压热电的热转换器，以及用于制造工业规模的热转换器的方法。

公开(公告)号：US06232542B1

公开(公告)日：2001-05-15

申请号：US09101700

申请日：1998-07-15

申请人： Hisato Hiraishi ,  Shigeru Watanabe

发明人： Hisato Hiraishi ,  Shigeru Watanabe

IPC分类号： H01L3534

CPC分类号： H01L35/34 ,  H01L35/32

摘要： The invention provides a method of fabricating a thermoelectric device, whereby a grooved block (11) composed of n-type thermoelectric semiconductor and a grooved block (21) composed of p-type thermoelectric semiconductor, provided with a plurality of grooves (16, 26) formed therein, respectively, at a same pitch and parallel with each other, are formed such that a depthwise portion of respective grooved blocks is left intact, and then, an integrated block (3) is formed by fitting and adhering together the grooved blocks (11, 21) composed of the n-type and p-type thermoelectric semiconductors, respectively, filling up gaps in fitting parts with adhesive insulation members. After removing portions of the integrated block (3), other than the fitting parts where the n-type and p-type thermoelectric semiconductors are fitted to each other, n-type and p-type thermoelectric semiconductor pieces are exposed, and by forming electrodes for connecting the pieces to each other alternately and in series, the thermoelectric device is completed. Further, it is preferable to apply a process of exposing the thermoelectric semiconductor pieces and a process of forming the electrodes after applying a process of forming grooves to the integrated block (3) such that a plurality of grooves are formed in the direction crossing the direction in which the grooves (16, 26) have been formed, leaving a depthwise portion of the integrated block (3) intact, and insulation members filling up the grooves thus formed are solidified.