发明授权
US06445047B1 Semiconductor device and method for fabricating the same 有权
半导体装置及其制造方法

  • 专利标题: Semiconductor device and method for fabricating the same
  • 专利标题(中): 半导体装置及其制造方法
  • 申请号: US09695381
    申请日: 2000-10-25
  • 公开(公告)号: US06445047B1
    公开(公告)日: 2002-09-03
  • 发明人: Takayuki YamadaMasaru Moriwaki
  • 申请人: Takayuki YamadaMasaru Moriwaki
  • 优先权: JP11-303414 19991026
  • 主分类号: H01L2976
  • IPC分类号: H01L2976
Semiconductor device and method for fabricating the same
摘要:
A semiconductor device includes: a first-surface-channel-type MOSFET having a first threshold voltage; and a second-surface-channel-type MOSFET with a second threshold voltage having an absolute value greater than an absolute value of said first threshold voltage. The first-surface-channel-type MOSFET includes: a first gate insulating film formed on a semiconductor substrate; and a first gate electrode, which has been formed out of a poly-silicon film over the first gate insulating film. The second-surface-channel-type MOSFET includes: a second gate insulating film formed on the semiconductor substrate; and a second gate electrode, which has been formed out of a refractory metal film over the second gate insulating film. The refractory metal film is made of a refractory metal or a compound thereof.
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