The present invention provides for a method and an apparatus for using equipment state data for controlling a manufacturing process. Initial equipment state data is acquired. At least one semiconductor device is processed using the initial equipment state data is performed. Equipment and wafer state data processing is performed using data from the processing of the semiconductor device and the initial equipment state data. A determination is made whether at least one control input parameter used for processing of the semiconductor device is to be modified in response to performing the equipment and wafer state data processing. The control input parameter is modified in response to determining that at least one the control input parameter is to be modified.