发明授权
- 专利标题： Process for the chemical treatment of semiconductor wafers
- 专利标题（中）： 半导体晶片的化学处理工艺
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申请号： US09882207申请日： 2001-06-15
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公开(公告)号： US06451124B1公开(公告)日： 2002-09-17
- 发明人: Roland Brunner
- 申请人： Roland Brunner
- 优先权： DE10036691 20000727
- 主分类号： C23G102
- IPC分类号： C23G102
摘要：
A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.
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