Conductive paste and semiconductor component having conductive bumps made from the conductive paste

发明授权

US06451127B1 Conductive paste and semiconductor component having conductive bumps made from the conductive paste 有权

标题翻译：导电浆料和具有由导电浆料制成的导电凸块的半导体部件

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专利标题： Conductive paste and semiconductor component having conductive bumps made from the conductive paste
专利标题（中）： 导电浆料和具有由导电浆料制成的导电凸块的半导体部件
申请号： US09323464

申请日： 1999-06-01
公开(公告)号： US06451127B1

公开(公告)日： 2002-09-17
发明人: Li Li , Treliant Fang
申请人： Li Li , Treliant Fang
主分类号： B23K35363
IPC分类号： B23K35363

Conductive paste and semiconductor component having conductive bumps made from the conductive paste

摘要：

A conductive paste composition is described which comprises an alloy of tin and a flux composition. The flux composition comprises an aromatic carboxylic acid fluxing agent and a polymeric solvent.

摘要（中）：

描述了包含锡和助熔剂组合物的合金的导电糊组合物。助熔剂组合物包含芳族羧酸助熔剂和聚合物溶剂。

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