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23 条记录 (耗时 0.012 秒)

    Solder paste
    1.
    发明授权
    Solder paste 有权
    焊膏

    公开(公告)号：US06736907B2

    公开(公告)日：2004-05-18

    申请号：US10308167

    申请日：2002-12-03

    申请人： Toshihiko Taguchi ,  Kunihito Takaura ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

    发明人： Toshihiko Taguchi ,  Kunihito Takaura ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

    IPC分类号： B23K35363

    CPC分类号： B23K35/3618 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3484

    摘要： A lead-free solder paste comprises an Sn—Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).

    摘要翻译： 无铅焊膏包含与焊剂混合的Sn-Zn基无铅焊料粉末。 助熔剂含有至少一种芳族羟基羧酸，其选自间位具有一个羟基的芳族羧酸（如3-羟基-2-甲基苯甲酸）和具有至少两个羟基的芳族羧酸（如 作为二羟基萘甲酸或二羟基苯甲酸），为0.1-10.0质量％。 助熔剂还可以含有0.5〜20质量％的脂肪族羟基羧酸（如羟基油酸）。

    Conductive paste and laminated ceramic electronic component using the same
    2.
    发明授权
    Conductive paste and laminated ceramic electronic component using the same 有权
    导电胶和层压陶瓷电子元件使用相同

    公开(公告)号：US06478882B2

    公开(公告)日：2002-11-12

    申请号：US09893174

    申请日：2001-06-27

    申请人： Takaharu Miyazaki ,  Tsuyoshi Yamana

    发明人： Takaharu Miyazaki ,  Tsuyoshi Yamana

    IPC分类号： B23K35363

    CPC分类号： H01G4/0085 ,  H05K1/092

    摘要： A laminated ceramic electronic component, such as a laminated ceramic capacitor, having superior heat shock resistance and humidity loading resistance is provided, in which no delamination occurs during a firing step. A conductive paste advantageously used for forming internal electrodes and a laminated ceramic electronic component using the conductive paste are provided. The conductive paste is a conductive powder primarily composed of Ni; an organic vehicle; a compound A which is at least one of an organic acid metal salt, an organic metal complex salt and an alkoxide, and which contains at least one of Mg, Ca and Ba; and a hydrolyzed compound B containing at least one of Al and Si; wherein the hydrolyzed compound B is adhered to the surface of the conductive powder.

    摘要翻译： 提供了具有优异的耐热冲击性和耐湿负荷性的层压陶瓷电子部件，例如层压陶瓷电容器，其中在烧制步骤中不发生分层。 提供有利地用于形成内部电极的导电浆料和使用导电浆料的层压陶瓷电子部件。 导电膏是主要由Ni构成的导电粉末; 有机车辆 化合物A，其为有机酸金属盐，有机金属络合盐和醇盐中的至少一种，并且含有Mg，Ca和Ba中的至少一种; 和含有Al和Si中的至少一种的水解化合物B; 其中水解化合物B粘附到导电粉末的表面。

    Solder and soldering method
    7.
    发明授权
    Solder and soldering method 失效
    焊接和焊接方法

    公开(公告)号：US06284057B1

    公开(公告)日：2001-09-04

    申请号：US09114630

    申请日：1998-07-13

    申请人： Osamu Asagi ,  Moriyuki Ebizuka ,  Koichi Shiozawa ,  Kiyoshi Ichikawa

    发明人： Osamu Asagi ,  Moriyuki Ebizuka ,  Koichi Shiozawa ,  Kiyoshi Ichikawa

    IPC分类号： B23K35363

    CPC分类号： H05K3/3484 ,  B23K1/203 ,  B23K35/025

    摘要： Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer. The soldering paste obtained by mixing this photosetting flux is printed and bonded on the surface of soldered portion of a printed substrate, and is brought into tight contact with the pad portion of a lead of an electronic part to be soldered. The surface of soldering paste exposed is irradiated with ultraviolet light to cause the surface to gel. Thereafter, soldering is effected by means of preliminary heating and solder melting and heating (reflow heating). Since the surface of the soldering paste is thereby hardened by the irradiation of ultraviolet light, no sags occur during preliminary heating, thus making it possible to prevent any defective bridge caused by sags.

    摘要翻译： 将焊料与通过紫外线照射而固化的光固化剂混合而获得的焊膏用于回流焊接。 光固化剂含有助焊剂基料，助熔剂基料溶剂，光聚合引发剂和光固化预聚物。 将通过混合该光固化剂获得的焊膏印刷并粘接在印刷基板的焊接部分的表面上，并与待焊接的电子部件的引线的焊盘部分紧密接触。 用紫外线照射暴露的焊膏表面使其表面凝胶化。 此后，通过预热和焊料熔化和加热（回流加热）进行焊接。 由于焊膏的表面由于紫外线的照射而被硬化，所以在预加热期间不会发生凹陷，从而可以防止由于凹陷引起的任何有缺陷的桥。

    Flux cored preforms for brazing
    8.
    发明授权
    Flux cored preforms for brazing 有权
    用于钎焊的助焊剂芯预成型件

    公开(公告)号：US06830632B1

    公开(公告)日：2004-12-14

    申请号：US10202148

    申请日：2002-07-24

    申请人： Charles E. Fuerstenau ,  Alan Belohlav

    发明人： Charles E. Fuerstenau ,  Alan Belohlav

    IPC分类号： B23K35363

    CPC分类号： B23K35/0266 ,  B23K35/02 ,  B23K35/0216 ,  B23K35/0227 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/406

    摘要： A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy.

    摘要翻译： 适用于彼此钎焊零件的线材预制件。 预成型件由具有助焊剂材料芯的线的长度以及在导线的长度上延伸的纵向接缝或间隙制成。 接缝被形成为使得当加热时，助熔剂材料从芯部流出并离开接缝。 线的长度为具有一定周长的环形，使得当预制件被加热时，助焊剂材料从预制件的圆周均匀地分散，以均匀地处理其上放置有预制件的部件的表面。 线的长度可以包括银合金。

    Iron-chromium base brazing filler metals
    9.
    发明授权
    Iron-chromium base brazing filler metals 有权
    铁铬基钎料金属

    公开(公告)号：US06656292B1

    公开(公告)日：2003-12-02

    申请号：US10171132

    申请日：2002-06-13

    申请人： Anatol Rabinkin ,  Nicholas J. Decristofaro

    发明人： Anatol Rabinkin ,  Nicholas J. Decristofaro

    IPC分类号： B23K35363

    CPC分类号： B23K35/308 ,  B23K35/0233 ,  B23K2101/14 ,  B23K2103/05 ,  Y10T29/4935 ,  Y10T29/49393 ,  Y10T428/12944 ,  Y10T428/12951

    摘要： A plurality of parts are brazed using an iron/chromium brazing filler metal. The parts are preferably composed of stainless steel and the brazed assembly forms a heat exchanger characterized by good corrosion resistance and low rates of leaching of Ni into fluids passing therethrough. The heat exchanger is especially suited for use in processing items intended to be ingested by humans or animals. Leaching rates and corrosion resistance are further enhanced by a post-brazing conditioning step wherein the assembly is heated in an oxygen-containing atmosphere to a temperature ranging from about 150° to 600° C. The preferred iron/chromium brazing filler metal consists essentially of a composition having the formula FeaCrbCocNidMoeWfBgSih wherein the subscripts “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h” are in atom percent and wherein, “b” ranges from about 5 to 20, “c” ranges from 0 to about 30, “d” ranges from 0 to about 20, “e” ranges from 0 to about 5, “f” ranges from 0 to about 5, “g” ranges from about 8 to 15, “h” ranges from about 8 to 15, and the sum “a”+“b”+“c”+“d”+“e”+“f”+“g”+“h”=100, the balance being incidental impurities present in an amount up to about 1 percent by weight of the total composition.

    摘要翻译： 使用铁/铬钎料金属钎焊多个部件。 部件优选由不锈钢构成，并且钎焊组件形成热交换器，其特征在于具有良好的耐腐蚀性和低的Ni浸出通过其中的流体的速率。 热交换器特别适用于加工人类或动物摄入的物品。 通过后钎焊调节步骤进一步提高浸出率和耐腐蚀性，其中将组合物在含氧气氛中加热至约150℃至600℃的温度。优选的铁/铬钎料填料金属主要由 其中下标“a”，“b”，“c”，“d”，“e”，“f”，“g”和“h”分别为原子百分数，其中，“b”表示的结构式为FeaCrbCocNidMoeWfBgSih “范围为约5至20，”c“为0至约30，”d“为0至约20，”e“为0至约5，”f“为0至约5，”g “的范围为约8至15，”h“的范围为约8至15，和”a“+”b“+”c“+”d“+”e“+”f“+”g“+” h“= 100，余量是以总组合物重量计高达约1重量％的杂质。