发明授权
- 专利标题： Use of blind vias for soldered interconnections between substrates and printed wiring boards
- 专利标题（中）： 对基板和印刷电路板之间的焊接互连使用盲孔
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申请号： US09796389申请日： 2001-02-28
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公开(公告)号： US06452116B2公开(公告)日： 2002-09-17
- 发明人: Gregg J. Armezzani , Kishor V. Desai , Jeffrey S. Perkins , John J. Pessarchick
- 申请人： Gregg J. Armezzani , Kishor V. Desai , Jeffrey S. Perkins , John J. Pessarchick
- 主分类号： H01R909
- IPC分类号： H01R909
摘要：
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.
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