An optical coupling assembly is described that optically aligns an opto-electronic device, such as a Vertical Cavity Surface Emitting Laser (VCSEL) chip, with a fiber optic coupler upon a heatsink substrate. The assembly has a number of biasing elements that acts against the coupler to provide contact with mating surfaces. Adjustment devices, such as screws, acting against the coupler and biasing elements, are adjusted until the fiber optic transmitting elements of the coupler align with the opto-electronic device light emitting elements. Photodetectors disposed upon a distal end of the coupler receive the light from the opto-electronic device, and provide a mechanism to detect optimum alignment.