发明授权
- 专利标题: Polisher and method for manufacturing same and polishing tool
- 专利标题(中): 抛光机及其制造方法及抛光工具
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申请号: US09629440申请日: 2000-07-31
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公开(公告)号: US06454644B1公开(公告)日: 2002-09-24
- 发明人: Hisamitsu Miyazaki , Hirokuni Hiyama , Yutaka Wada
- 申请人: Hisamitsu Miyazaki , Hirokuni Hiyama , Yutaka Wada
- 主分类号: B24D1100
- IPC分类号: B24D1100
摘要:
A polishing tool uses a fixed abrasive polisher which can perform polishing of an object with good surface accuracy for a long period of time. A mixture of abrasive grains, having an average particle diameter of 0.01 to 2.0 &mgr;m, and comprising at least one of cerium oxide, manganese oxide, titanium oxide, zirconia, silica, and iron oxide, and polyimide resin particles or phenolic resin particles having an average particle diameter of 0.1 to 20 &mgr;m is heated at a temperature of 120 to 250° C. under a pressure of 9,800 to 49,000 kPa (100 to 500 kg/cm2) to mold the mixture into a desired shape. This can provide a polisher 4 having abrasive grains dispersed in a thermosetting resin, and having abrasive grains of 20 to 60% by volume, a binder of 30 to 50% by volume, pores of not more than 40% by volume, and a Rockwell hardness of not less than 30 in terms of the H scale. This polisher is attached to a surface plate by an epoxy adhesive to produce a polishing tool.