公开(公告)号：US06454644B1

公开(公告)日：2002-09-24

申请号：US09629440

申请日：2000-07-31

申请人： Hisamitsu Miyazaki ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Hisamitsu Miyazaki ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24D1100

CPC分类号： B24B37/26 ,  B24B37/245 ,  B24D3/32 ,  B24D7/06 ,  B24D18/0009

摘要： A polishing tool uses a fixed abrasive polisher which can perform polishing of an object with good surface accuracy for a long period of time. A mixture of abrasive grains, having an average particle diameter of 0.01 to 2.0 &mgr;m, and comprising at least one of cerium oxide, manganese oxide, titanium oxide, zirconia, silica, and iron oxide, and polyimide resin particles or phenolic resin particles having an average particle diameter of 0.1 to 20 &mgr;m is heated at a temperature of 120 to 250° C. under a pressure of 9,800 to 49,000 kPa (100 to 500 kg/cm2) to mold the mixture into a desired shape. This can provide a polisher 4 having abrasive grains dispersed in a thermosetting resin, and having abrasive grains of 20 to 60% by volume, a binder of 30 to 50% by volume, pores of not more than 40% by volume, and a Rockwell hardness of not less than 30 in terms of the H scale. This polisher is attached to a surface plate by an epoxy adhesive to produce a polishing tool.

摘要翻译： 抛光工具使用固定磨料抛光机，其可以长时间对表面精度进行抛光。 平均粒径为0.01〜2.0μm，并且包含氧化铈，氧化锰，氧化钛，氧化锆，二氧化硅和氧化铁中的至少一种的磨粒的混合物，以及聚酰亚胺树脂粒子或酚醛树脂粒子 将平均粒径为0.1〜20μm的树脂在温度为120〜250℃，压力为9,800〜49000kPa（100〜500kg / cm2）的条件下加热，成型为所需的形状。 这可以提供一种抛光机4，其具有分散在热固性树脂中的磨粒，并且具有20至60体积％的磨料颗粒，30至50体积％的粘合剂，不超过40体积％的孔，以及洛氏 硬度以H比例计不低于30。 该抛光机通过环氧树脂粘合剂附接到表面板以产生抛光工具。

公开(公告)号：US20050155868A1

公开(公告)日：2005-07-21

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H5/08 ,  B24B37/04 ,  C25F1/00 ,  C25F3/00 ,  H01L21/321 ,  H01L21/768 ,  B23H3/00

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

公开(公告)号：US06520845B2

公开(公告)日：2003-02-18

申请号：US09813323

申请日：2001-03-21

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

摘要翻译： 抛光装置包括抛光构件，其具有宽的稳定的抛光范围以进行有效的抛光，即使旋转轴线远离工件的边缘移动。 抛光构件保持器保持抛光构件，并且工件保持器保持待抛光的工件。 驱动装置在抛光构件和工件之间产生相对滑动运动。 抛光构件保持器或工件保持器中的至少一个保持器可围绕旋转轴线旋转并且可相对于其他保持器倾斜。 这种一个保持器设置有按压机构，以通过在远离旋转轴线的位置向一个保持器施加调节压力来稳定一个保持器的取向或期望姿势。

公开(公告)号：US06220945B1

公开(公告)日：2001-04-24

申请号：US09296567

申请日：1999-04-22

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B37/30 ,  B24B7/228 ,  B24B37/105 ,  B24B41/068 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.

公开(公告)号：US20100081361A1

公开(公告)日：2010-04-01

申请号：US12566224

申请日：2009-09-24

申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

IPC分类号： B24B53/02 ,  B24B1/00 ,  B24B53/12

CPC分类号： B24B53/017

摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

摘要翻译： 提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。 模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。

公开(公告)号：US06402588B1

公开(公告)日：2002-06-11

申请号：US09300383

申请日：1999-04-27

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B4900

CPC分类号： B24B41/068 ,  B24B7/228 ,  B24B37/30 ,  B24B49/04 ,  B24B53/017

摘要： The object of the present invention is to provide a polishing apparatus having a grinding member in a compact design that can provide high efficiency for both polishing and dressing operations, and prevents tilting of the grinding member even if the rotation axis thereof is moved away from the outer periphery of the object. A polishing apparatus for an object, comprises: an object holder for holding an object to be polished, such that a surface of the object to be polished faces upward; a dresser disk holder for holding a dresser disk for dressing, such that a dressing surface thereof faces upward; and a grinding member for polishing the object, and for being dressed by the dresser disk, by pressing and sliding the grinding member relative to the object and the dresser disk. Thereby, the surface to be polished and the dressing surface are arranged so as to be coploanar, and the grinding member having an abrasive surface facing downward, is disposed so as to straddle the surface to be polished of the object and the dressing surface of the dresser disk to perform polishing of the surface to be polished and dressing of the abrasive surface of the grinding member.

摘要翻译： 本发明的目的是提供一种研磨装置，其具有紧凑设计的研磨构件，其可以为抛光和修整操作提供高效率，并且防止研磨构件的倾斜，即使其旋转轴线远离 物体的外围。 一种物体的抛光装置，包括：用于保持被抛光物体的物体保持器，使得待抛光物体的表面朝上; 修整器盘保持器，用于保持修整器盘用于修整，使得其修整面朝上; 以及研磨构件，用于抛光所述物体，并且由所述修整器盘修整，通过相对于所述物体和所述修整器盘压下并滑动所述研磨构件。 由此，被抛光面和修整面被配置成为共面的，并且具有面向下方的研磨面的研磨构件配置成跨越物体的被研磨面和修整面 修整器盘以执行抛光表面的抛光和研磨构件的研磨表面的修整。

公开(公告)号：US06325698B1

公开(公告)日：2001-12-04

申请号：US09387553

申请日：1999-09-01

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US07527723B2

公开(公告)日：2009-05-05

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H7/36 ,  B23H1/10 ,  B23H3/10

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

公开(公告)号：US07169235B2

公开(公告)日：2007-01-30

申请号：US10844317

申请日：2004-05-13

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： C23G1/02

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US06672945B1

公开(公告)日：2004-01-06

申请号：US09641347

申请日：2000-08-18

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B53/001 ,  B24B53/12 ,  B24B55/02

摘要： A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when generating light rays for irradiating the polishing surface of the abrasive member, whereby dressing the polishing surface. A temperature control system control the temperature of the polishing surface of the abrasive member by sensing the temperature of the polishing surface with the temperature sensor. Mechanical dressing of the polishing surface, in addition to dressing by radiation of the polishing surface, may also be employed in order to flatten the entire polishing surface. The abrasive member preferably includes an abrasive particles, a binder and a photophilic for promoting the dressing of the polishing surface by light rays.

摘要翻译： 抽象抛光装置具有基板载体，基底和具有抛光表面的磨料构件。 该表面与衬底滑动接合以便进行抛光。 修整装置在产生用于照射研磨部件的研磨面的光线时包括光源，由此修整研磨面。 温度控制系统通过用温度传感器感测研磨表面的温度来控制研磨部件的抛光表面的温度。 抛光表面的机械修整除了通过抛光表面的辐射进行修整之外，还可以采用平整整个抛光表面。 磨料构件优选地包括研磨颗粒，粘合剂和亲水性用于通过光线促进抛光表面的修整。