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US06458698B2 Controlled-stress stable metallization for electronic and electromechanical devices 有权
电子和机电设备的受控应力稳定金属化

  • Patent Title: Controlled-stress stable metallization for electronic and electromechanical devices
  • Patent Title (中): 电子和机电设备的受控应力稳定金属化
  • Application No.: US09908112
    Application Date: 2001-07-17
  • Publication No.: US06458698B2
    Publication Date: 2002-10-01
  • Inventor: Ilan Golecki , Margaret Eagan
  • Applicant: Ilan Golecki , Margaret Eagan
  • Main IPC: H01L2144
  • IPC: H01L2144
Controlled-stress stable metallization for electronic and electromechanical devices
Abstract:
A method of forming a thin film metallization layer having a predetermined residual stress and a predetermined sheet resistance and force measuring devices formed using the methods.
Abstract(Chinese):

一种形成具有预定残余应力的薄膜金属化层和预定的薄层电阻的方法以及使用这些方法形成的力测量装置。

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