A vacuum processing apparatus for performing plasma etching in a processing chamber on a base. An actuator, when lowered, forms a closed processing chamber by pressing a lid member onto a work platform, and, when raised, opens the processing chamber by setting the lid member apart from the work platform. The actuator is disposed above the lid member, and frame posts and conveying means, of the work are disposed so as not to block the front side of the lid member, and therefore a free working space for serviceman is kept at the front side of the lid member. Therefore, the serviceman can easily do maintenance work of the lid member or preparation of the processing chamber.