发明授权
- 专利标题： Conductive composition, conductive adhesive, and their mounting structure
- 专利标题（中）： 导电组合物，导电胶及其安装结构
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申请号： US09691183申请日： 2000-10-19
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公开(公告)号： US06468448B1公开(公告)日： 2002-10-22
- 发明人: Kazuyoshi Amami , Emiko Igaki , Minehiro Itagaki
- 申请人： Kazuyoshi Amami , Emiko Igaki , Minehiro Itagaki
- 优先权： JP11-300534 19991022
- 主分类号： H01B106
- IPC分类号： H01B106
摘要：
A pH adjusting agent is added to a conductive adhesive to prevent the dissolution of a conductive particle to improve the reliability of a mounting structure, wherein when a pH environment is produced in which the conductive particle is easy to dissolve in the surrounding of the conductive adhesive, the pH adjusting agent can change the pH environment to a pH environment in which the conductive particle is resistant to dissolving.
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