公开(公告)号：US06468448B1

公开(公告)日：2002-10-22

申请号：US09691183

申请日：2000-10-19

申请人： Kazuyoshi Amami ,  Emiko Igaki ,  Minehiro Itagaki

发明人： Kazuyoshi Amami ,  Emiko Igaki ,  Minehiro Itagaki

IPC分类号： H01B106

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/16 ,  H01L24/28 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0769 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A pH adjusting agent is added to a conductive adhesive to prevent the dissolution of a conductive particle to improve the reliability of a mounting structure, wherein when a pH environment is produced in which the conductive particle is easy to dissolve in the surrounding of the conductive adhesive, the pH adjusting agent can change the pH environment to a pH environment in which the conductive particle is resistant to dissolving.

摘要翻译： 向导电性粘合剂中添加pH调节剂以防止导电性粒子的溶解，提高安装结构的可靠性，其中，当产生导电性粒子容易溶解于导电性粘合剂的周围的pH环境时 ，pH调节剂可以将pH环境改变为其中导电颗粒耐溶解的pH环境。

公开(公告)号：US06703262B2

公开(公告)日：2004-03-09

申请号：US09195514

申请日：1998-11-19

申请人： Minehiro Itagaki ,  Yoshihiro Tomuro ,  Satoru Yuhaku ,  Kazuyoshi Amami

发明人： Minehiro Itagaki ,  Yoshihiro Tomuro ,  Satoru Yuhaku ,  Kazuyoshi Amami

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/1105 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

公开(公告)号：US06818461B2

公开(公告)日：2004-11-16

申请号：US10062463

申请日：2002-02-05

申请人： Kazuyoshi Amami ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Kazuyoshi Amami ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： G01R3126

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H01L2924/00014

摘要： A mounting structure is formed by flip-chip mounting a semiconductor device onto a substrate. An electrical connecting portion of the semiconductor device is connected to an electrical connecting portion of the substrate by means of an electrically conductive adhesive. A region of the semiconductor device which is not involved in electrical connection is bonded to a region of the substrate which is not involved in electrical connection by means of an adhesive. A test of electrical properties is performed on the semiconductor device and the substrate which are connected to each other. If it is determined that the electrical properties are poor in the test, the semiconductor device is separated from the substrate after heating a bonding place of the adhesive up to a temperature higher than a glass transition point or a melting point of the adhesive. If it is determined that the electrical properties are good in the test, the semiconductor device and the substrate are sealed by means of a sealing resin.

摘要翻译： 通过将半导体器件倒装安装到衬底上来形成安装结构。 半导体器件的电连接部分通过导电粘合剂连接到基片的电连接部分。 不参与电连接的半导体器件的区域通过粘合剂结合到不涉及电连接的基板的区域。 对彼此连接的半导体器件和衬底进行电特性的测试。 如果在测试中确定电气性能差，则在将粘合剂的粘合位置加热到高于粘合剂的玻璃化转变点或熔点的温度之后，半导体器件与基板分离。 如果在测试中确定电性能良好，则半导体器件和衬底通过密封树脂密封。

公开(公告)号：US06756663B2

公开(公告)日：2004-06-29

申请号：US10337879

申请日：2003-01-08

申请人： Tsukasa Shiraishi ,  Tsutomu Mitani ,  Kazuyoshi Amami ,  Yoshihiro Bessho

发明人： Tsukasa Shiraishi ,  Tsutomu Mitani ,  Kazuyoshi Amami ,  Yoshihiro Bessho

IPC分类号： H05K346

CPC分类号： H01L21/563 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/19107 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/056 ,  H05K2201/10386 ,  H05K2201/10674 ,  H05K2203/049 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.

摘要翻译： 半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。 通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。 半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。 半导体元件的电极通过布线板的三维布线彼此连接。

公开(公告)号：US06723251B2

公开(公告)日：2004-04-20

申请号：US10322406

申请日：2002-12-18

申请人： Minehiro Itagaki ,  Yoshihiro Tomuro ,  Satoru Yuhaku ,  Kazuyoshi Amami

发明人： Minehiro Itagaki ,  Yoshihiro Tomuro ,  Satoru Yuhaku ,  Kazuyoshi Amami

IPC分类号： B41J204

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/1105 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit board is pressed from above by a flat member on fixing thereof.

摘要翻译： 一种用于平面化电路板的方法，具有通过粘合剂层将具有布线层的电路板两面固定到具有平坦表面的板的步骤，其中所述电路板在固定时由平坦部件从上方按压。

公开(公告)号：US06525414B2

公开(公告)日：2003-02-25

申请号：US09725283

申请日：2000-11-29

申请人： Tsukasa Shiraishi ,  Tsutomu Mitani ,  Kazuyoshi Amami ,  Yoshihiro Bessho

发明人： Tsukasa Shiraishi ,  Tsutomu Mitani ,  Kazuyoshi Amami ,  Yoshihiro Bessho

IPC分类号： H05K346

CPC分类号： H01L21/563 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/19107 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/056 ,  H05K2201/10386 ,  H05K2201/10674 ,  H05K2203/049 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.

摘要翻译： 半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。 通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。 半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。 半导体元件的电极通过布线板的三维布线彼此连接。

公开(公告)号：US06429382B1

公开(公告)日：2002-08-06

申请号：US09547922

申请日：2000-04-11

申请人： Kazuyoshi Amami ,  Hiroaki Takezawa ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

发明人： Kazuyoshi Amami ,  Hiroaki Takezawa ,  Tsukasa Shiraishi ,  Yoshihiro Bessho

IPC分类号： H05K102

CPC分类号： H01L24/83 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0769 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/121 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/05644

摘要： For the reliability in insulation and against sulfurization, the mounting structure of the invention includes an electric structure, and an electrically conductive adhesive layer including an electrically conductive filler disposed on the electric structure, and at least a portion of surface of the electrically conductive filler is exposed to an external environment, and an elution preventive film is disposed on at least a portion of the exposed surface. Further, an electrically conductive adhesive of this invention includes the electrically conductive filler, and an elution preventive film is disposed on the entire surface of the electrically conductive filler.

摘要翻译： 为了绝缘和耐硫化的可靠性，本发明的安装结构包括电结构，以及包括设置在电结构上的导电填料的导电粘合剂层，并且导电填料表面的至少一部分是 暴露在外部环境中，并且防洗掉膜被设置在暴露表面的至少一部分上。 此外，本发明的导电性粘合剂包括导电填料，并且在导电填料的整个表面上设置防淘汰膜。

公开(公告)号：US5364253A

公开(公告)日：1994-11-15

申请号：US62956

申请日：1993-05-14

申请人： Kiyoshi Kojima ,  Kazuyoshi Amami ,  Hiroshi Ueda ,  Shizuo Furuyama ,  Yoshihiro Hara ,  Kyoichi Hasegawa ,  Tadashi Kawamata

发明人： Kiyoshi Kojima ,  Kazuyoshi Amami ,  Hiroshi Ueda ,  Shizuo Furuyama ,  Yoshihiro Hara ,  Kyoichi Hasegawa ,  Tadashi Kawamata

IPC分类号： B22F3/03 ,  B22F5/00 ,  B22F7/06 ,  B30B11/00 ,  B30B11/02 ,  H01F41/02 ,  H02K15/03 ,  H04R31/00 ,  B22F3/00

CPC分类号： B30B11/027 ,  B22F3/03 ,  B22F5/00 ,  B22F7/06 ,  B30B11/007 ,  H01F41/0266 ,  H02K15/03 ,  B22F2003/031 ,  B22F2003/033 ,  Y10S425/033

摘要： A magnetic circuit component molding device for integrally molding a compound a center yoke with a ring-shaped magnet includes top and bottom press vertically arranged at opposed positions. A ring-shaped magnet is place on a bottom die between top and bottom press. The top and bottom press compress the compound against the ring-shaped magnet ring with a vertical pressure. A holder unit, separated in plural segments, having tapered outer circumferences is provided around the ring-shaped. A holder presser having a tapered inner circumference is mounted on the holder unit as tapered portions thereof are engaged together. A portion of the vertical pressure, when the top press compresses the compound, is transferred by springs 10 to the holder presser, and is amplified by the tapered portions and applied to the outer circumference surface of the ring-shaped magnet by the holder unit.

摘要翻译： 用于将中心轭与环形磁体一体成型的磁路部件模制装置包括垂直地布置在相对位置的顶部和底部压力。 在顶部和底部压力机之间的底部模具上放置环形磁体。 顶部和底部压制件以垂直压力将化合物压在环形磁环上。 在环形周围设置有多个分段的具有锥形外周的保持器单元。 具有锥形内圆周的夹持器按压锥形部分接合在一起，安装在保持器单元上。 垂直压力的一部分，当顶压机压缩该化合物时，通过弹簧10传递到保持器压脚，并被锥形部分放大并通过保持器单元施加到环形磁体的外周表面。