发明授权
US06479346B1 Semiconductor memory device and fabrication method thereof 有权
半导体存储器件及其制造方法

  • 专利标题: Semiconductor memory device and fabrication method thereof
  • 专利标题(中): 半导体存储器件及其制造方法
  • 申请号: US09544214
    申请日: 2000-04-07
  • 公开(公告)号: US06479346B1
    公开(公告)日: 2002-11-12
  • 发明人: Sang-Bai YiJae-Min YuSung-Chul Lee
  • 申请人: Sang-Bai YiJae-Min YuSung-Chul Lee
  • 优先权: KR99/16622 19990510
  • 主分类号: H01L21336
  • IPC分类号: H01L21336
Semiconductor memory device and fabrication method thereof
摘要:
In a semiconductor memory device including memory cells and a peripheral circuit unit, a memory cell has a first gate structure formed on a semiconductor substrate; a first impurity region of a first conductive type formed in the substrate on a first side of the gate structure; and a second impurity region formed in the substrate on a second side of the gate structure, the second impurity region including: a third impurity region of the first conductive type, a fourth impurity region of the first conductive type between the third impurity region and the second side of the gate structure, and a halo ion region of a second conductive type formed adjacent to the fourth impurity region.
信息查询
0/0