发明授权
US06486411B2 Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
有权
半导体模块具有焊料凸块和具有不同材料和组成的焊料部分和电路基板
- 专利标题： Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
- 专利标题（中）： 半导体模块具有焊料凸块和具有不同材料和组成的焊料部分和电路基板
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申请号： US09811445申请日： 2001-03-20
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公开(公告)号： US06486411B2公开(公告)日： 2002-11-26
- 发明人: Kazuma Miura , Hanae Shimokawa , Koji Serizawa , Tasao Soga , Tetsuya Nakatsuka
- 申请人： Kazuma Miura , Hanae Shimokawa , Koji Serizawa , Tasao Soga , Tetsuya Nakatsuka
- 优先权： JP2000-180712 20000612
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.
公开/授权文献
- US20010050181A1 Semiconductor module and circuit substrate 公开/授权日：2001-12-13
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