发明授权
US06494219B1 Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
失效
具有用于去除不需要的电镀沉积物的蚀刻剂混合组件的装置
- 专利标题: Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits
- 专利标题(中): 具有用于去除不需要的电镀沉积物的蚀刻剂混合组件的装置
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申请号: US09614406申请日: 2000-07-12
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公开(公告)号: US06494219B1公开(公告)日: 2002-12-17
- 发明人: Radha Nayak , Yezdi Dordi , Joseph Stevens , Peter Hey
- 申请人: Radha Nayak , Yezdi Dordi , Joseph Stevens , Peter Hey
- 主分类号: B08B308
- IPC分类号: B08B308
摘要:
Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.
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