公开(公告)号：US06494219B1

公开(公告)日：2002-12-17

申请号：US09614406

申请日：2000-07-12

申请人： Radha Nayak ,  Yezdi Dordi ,  Joseph Stevens ,  Peter Hey

发明人： Radha Nayak ,  Yezdi Dordi ,  Joseph Stevens ,  Peter Hey

IPC分类号： B08B308

CPC分类号： H01L21/6708 ,  C23F1/08 ,  H01L21/02087 ,  H01L21/2885 ,  H01L21/32134 ,  H01L21/67051 ,  H01L21/67207 ,  Y10S134/902

摘要： Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.

摘要翻译： 本发明的实施例通常提供用于半导体处理系统的蚀刻剂混合组件。 蚀刻剂混合组件包括至少一个酸源，至少一个氧化剂源，选择性地与至少一个酸源和至少一个氧化剂源流体连通的混合罐，以及与混合物流体连通的混合蚀刻剂罐 坦克。 另外，系统控制器被配置为感测混合蚀刻剂槽中的低水平的流体，使得新鲜的流体溶液在混合罐中混合，并且使新鲜的流体溶液与混合的蚀刻剂槽相连，也提供在 蚀刻剂混合组件。

公开(公告)号：US06921494B2

公开(公告)日：2005-07-26

申请号：US10456723

申请日：2003-06-06

申请人： Brian J. Brown ,  Madhavi Chandrachood ,  Radha Nayak ,  Fred C. Redeker ,  Michael Sugarman ,  John M. White

发明人： Brian J. Brown ,  Madhavi Chandrachood ,  Radha Nayak ,  Fred C. Redeker ,  Michael Sugarman ,  John M. White

IPC分类号： B08B1/04 ,  B08B3/02 ,  B08B3/08 ,  B08B7/04 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC分类号： H01L21/6708 ,  H01L21/67075 ,  Y10S134/902

摘要： A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.

摘要翻译： 提供洗涤器装置。 洗涤器装置可以蚀刻晶片的背面并且可以同时清洁晶片的前侧。 洗涤器装置可以包括编程控制器，其适用于每当将蚀刻流体供应到晶片的背面时，将非蚀刻流体提供给晶片的前侧。